We are one of the leading manufacturers of semiconductor advanced packaging materials, established in Tainan, Taiwan in 1998, with over 28 years of operating experience in the electronics and semiconductor industry, operating under our corporate brand “Accurus”. We are principally engaged in the design, development, manufacturing and commercialisation of precision solder spheres, which serve as critical interconnect components enabling electrical conductivity between integrated circuits (“ICs”) and printed circuit boards (“PCBs”) across a broad spectrum of advanced semiconductor packaging applications. Our products and solutions are mainly used in end-use applications such as high-performance computing (“HPC”) for artificial intelligence (“AI”), memory (including high bandwidth memory (“HBM”)), mobile devices and wearables, and automotive applications.

Leveraging our proprietary alloy formulations, process know-how and engineering capabilities, we design solder spheres with varied compositions, sizes and performance characteristics, and work closely with our customers to develop customised solder sphere solutions tailored to their specific technical, performance and packaging requirements. Beyond our core solder spheres, we also produce solder-related materials and products, including solder ingots, copper core solder spheres (“CCSS”), solder paste and solder preforms, for internal use and customer supply, and we design and develop in-house much of the specialised machinery used in our production processes.

According to Yole, our market share of the global solder sphere market based on the serviceable addressable market (“SAM”) was 24.0% in 2025, placing us among the top three solder sphere suppliers worldwide. We have been part of the MiTB group since April 2021, operating as its Semiconductor Material Business Unit (“SMBU”), with MiTB listed on the Main Market of Bursa Malaysia Securities Berhad (“Bursa Malaysia”). Pursuant to the extraordinary general meeting of MiTB held on 17 September 2026, the shareholders of MiTB approved the spin-off of the SMBU and the Listing.

We are headquartered in Singapore and currently have production facilities in Tainan, Taiwan and Ningbo, the PRC. As at the Latest Practicable Date, the combined annual production capacity of our production facilities ranges from approximately 6,600.0 billion to 8,900.0 billion solder spheres, depending on the size of solder spheres that we produce based on the purchase orders received and our management of the utilisation of the production lines within our production facilities to produce our different products. To support our growth and diversify our production capability, we are in the process of establishing a third production facility in Senai, Johor, Malaysia, which is targeted to be ready for production by the fourth quarter of 2026, with production ramp-up in early 2027, and we plan to expand the production capacity of our facility in Taiwan. In addition, we intend to build a research and development (“R&D”) and demonstration centre in Texas, United States. Over the years, we have established ourselves as a key participant in the global semiconductor advanced packaging supply chain, with long-standing relationships, some of which span over 20 years, with integrated device manufacturers (“IDMs”), semiconductor foundries and outsourced semiconductor assembly and test providers (“OSATs”) across markets including Taiwan, the PRC, Malaysia, the European Union, Singapore, the United States, Japan, Korea and the Philippines.